J-System 33 is a low slump levelling compound suitable for all substrates prior to the installation of all types of floor coverings, including wood flooring, for thicknesses from 1 – 80 mm.
J-System 33 is a low slump levelling compound suitable for all substrates prior to the installation of all types of floor coverings, including wood flooring, for thicknesses from 1 – 80 mm.